Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026

SAN JOSE, Calif., Sept. 14, 2026 (GLOBE NEWSWIRE) -- Alchip Technologies, the high-performance ASIC leader, will showcase its leading-edge process technology and advanced packaging achievements in Booth 1705 at AI Infra Summit 2026.

The event runs from September 15 through September 17 at the Santa Clara Convention Center in Santa Clara, California.

At the exhibit, Alchip will discuss its 3nm designs in production and 2nm designs currently in development. The company will also showcase its complete 2nm design platform, 3nm I/O chiplet support, and functional optical interconnect capabilities. Today, 90% of the company’s designs use process technologies below 7nm.

Alchip will also focus on its advanced packaging capabilities, highlighting its 3DIC ecosystem readiness and experience working with multiple TSMC CoWoS® technologies. These capabilities include TSMC 2nm CoWoS® designs, TSMC CoWoS®-S and TSMC CoWoS®-R designs in production, TSMC CoWoS®-L and TSMC SoIC®-X designs in development. The company will highlight its proven 3DIC capabilities, co-packaged optics technology and high-performance die-to-die IP.

Alchip has completed more than 650 successful tape-outs since its founding in 2003 and currently completes 10 to 20 new tape-outs annually. Its track record covers more than 60 FinFET designs and more than 20 CoWoS designs, with a focus on AI and high-performance computing, networking and automotive applications.

About Alchip

Alchip Technologies Ltd., founded in 2003 and headquartered in Taipei, Taiwan, is a leading global High-Performance Computing and AI infrastructure ASIC provider of IC and packaging design, and production services for companies developing complex and high-volume ASICs and SoCs.  Alchip provides faster time-to-market and cost-effective solutions for SoC design at mainstream and advanced process technology. Alchip has built its reputation as a high-performance ASIC leader through its advanced 2.5D/3D CoWoS packaging, chiplet design, and manufacturing management. Customers include global leaders in artificial intelligence, high-performance computing, supercomputing, mobile communications, entertainment device, networking equipment, and other electronic product categories. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661).

Note: CoWoS®, CoWoS®-S and CoWoS®-R, CoWoS®-L, SoIC®, and related advanced packaging terminology are trademarks or registered trademarks of Taiwan Semiconductor Manufacturing Company Limited (TSMC). They are used here solely to describe TSMC technologies incorporated within Alchip’s design and development activities.

For more information, please visit our website: http://www.alchip.com

Charles Byers
Alchip Technologies
+ (408)-310-9244
chuck_byers@alchip.com