Applied Materials, Intel Partner to Accelerate AI Chipmaking Technologies

By Adriano Marchese


Applied Materials and Intel have joined forces to boost the development of next-generation silicon technologies designed specifically for artificial intelligence workloads.

Applied Materials, a materials engineering company, on Tuesday said that its collaboration with the chipmaker will span across its new EPIC Center and Intel's R&D campus in Hillsboro, Oregon. The aim is to speed up development of transistors, interconnects and advanced packaging technologies that will be used in AI computing and shorten time-to-market of advanced semiconductor technologies.

The collaboration will focus on next-generation materials, process technologies and device architectures for advanced logic nodes that target AI workloads and back-end-of-line advancements, it said.

Financial details of the deal weren't disclosed.


Write to Adriano Marchese at adriano.marchese@wsj.com


(END) Dow Jones Newswires

October 06, 2026 09:54 ET (13:54 GMT)

Copyright (c) 2026 Dow Jones & Company, Inc.

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