Intel, Lens Technology to Collaborate on Semiconductor Packaging
By Elias Schisgall
Intel and Lens Technology are entering a strategic collaboration to develop new semiconductor packaging technologies.
The two companies on Friday said they will explore possible areas of cooperation to scale the manufacturing and adoption of next-generation semiconductor packaging.
"Intel brings deep expertise in semiconductor architecture and advanced packaging technologies, while Lens Technology contributes world-class capabilities in precision glass processing, laser manufacturing, and large-scale production," Intel Chief Executive Lip-Bu Tan said. "Together, we have an opportunity to explore new approaches to advanced packaging that can help unlock the next generation of system-level innovation for the AI era."
The collaboration may also extend to other complementary technologies, including artificial-intelligence personal computer components, AI hardware platforms, and data-center thermal and structural solutions, the companies said.
Intel on Thursday reported surging sales in its second quarter on continued computing demand driven by AI. The company also raised its capital expenditures outlook for this year to more than $20 billion, and projected even heavier spending in 2027.
Shares in Intel were down 4% to $96.18. The stock has gained more than one-and-a-half times its value this year.
Write to Elias Schisgall at elias.schisgall@wsj.com
(END) Dow Jones Newswires
July 24, 2026 14:00 ET (18:00 GMT)
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