BE Semiconductor Industries NV

BESI: XAMS (NLD)

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Besi: HBM Thickness Debate Triggers Share Drop, but Hybrid Bonding Path Is Inevitable

Javier Correonero

Mar 6, 2026

According to technology media outlet ZDNet, Samsung and SK Hynix are considering relaxing their thickness standards for high-bandwidth memory, a development that could affect the timeline of hybrid bonding adoption. Besi shares were down more than 15% on March 6 in response.

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BE Semiconductor Industries NV

Besi: HBM Thickness Debate Triggers Share Drop, but Hybrid Bonding Path Is Inevitable

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