Articles From: Invensas and Tezzaron Partner to Deliver Commercial 3D-IC Products to Inventure Foods to Host Conference Call to Discuss Third Quarter 2013 Results on Oct. 31, 2013 at 11 a.m. ET


2013/12/12
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it is partnering with Tezzaron Semiconductor Corporation, a pioneer and producer of 3D Integrated Circuit (3D-IC) semiconductor devices, in order to build a wide range of 3D-IC customer products.
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Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), will display its latest xFD TM products solutions at CES Las Vegas, Jan.
Sign-up for Invensas Shows New xFD-Based Customer Products with Etron Technology at CES, Las Vegas investment picks
2013/9/10
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA) , will demonstrate recent advancements and customer applications in Multi-Die Face-Down (xFD TM ) products, Bond Via Array (BVA TM ) mobile solutions, and 3DIC technologies at the Intel Developer Forum (IDF), Moscone Center West, San Francisco, Sept.
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Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), today announced that it received the Frost & Sullivan 2013 North American Customer Value Enhancement Award in 3D Packaging and 3D IC Market for Mobile Computing for its Bond Via Array (BVA™) mobile technology.
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2014/2/10
GENEVA and SAN JOSE, Calif., Feb.
Sign-up for InvenSense and STMicroelectronics Announce Settlement of Pending Patent Litigation investment picks
2014/1/2
InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking ™ sensor system on chip (SoC) and Sound devices, will showcase the company’s latest ‘AlwaysOn’ innovations for smartphones, tablets, wearables, and consumer electronics at the CES 2014 tradeshow.
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2013/8/2
InvenSense, Inc. (NYSE: INVN) , the leading provider of MotionTracking ™ system on chip devices, is relocating its headquarters to 1745 Technology Drive, San Jose, California.
Sign-up for InvenSense™ Announces New Offices Accommodating Continued Company Growth investment picks
2014/2/24
InvenSense, Inc. (NYSE:INVN), the leading provider of MotionTracking ™ sensor system on chip (SoC) and Sound devices, announces a turnkey wearable platform solution intended to substantially shorten the time-to-market for any OEM or ODM.
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2013/10/10
InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking ™ system on chip devices, announced that Adam Tachner has been named vice president and general counsel.
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InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking ™ system on chip devices, announced the opening of a new design center in Seoul, Korea.
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InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking ™ sensor system on chip (SoC) and Sound devices, announces the next generation ultra low-power motion and audio family of solutions enabling a complete ‘AlwaysOn’ wearable experience.
Sign-up for InvenSense™ Introduces Family of ‘AlwaysOn’ MEMS Automatic Activity Recognition Solutions for the Wearable Sensor Market investment picks
InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking sensor system on chip (SoC) and Sound devices, announces a family of motion and audio solutions for the smartphone market enabling a complete ‘AlwaysOn’ experience.
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InvenSense, Inc. (NYSE:INVN), the leading provider of MotionTracking ™ system on chip (SoC) and Sound devices, announces the sampling of the ICS-40720 analog MEMS microphone for the CE market to select customers.
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2014/2/25
InvenSense, Inc. (NYSE:INVN), the leading provider of MotionTracking ™ system on chip (SoC) and Sound devices, announces the InvenSense ICS-40161 top port MEMS microphone targeted towards mobile electronic devices such as smartphones, tablets, remote controls, smart TVs, Bluetooth headsets, and digital still/video cameras.
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InvenSense, Inc. (NYSE:INVN), the leading provider of MotionTracking ™ system on chip devices, announced the 6-axis MPU-6515 MEMS SoC and corresponding MotionApps ™ software platform optimized to support key new functions introduced in Android KitKat.
Sign-up for InvenSense™ Introduces the World’s First MotionTracking SoC Optimized for Google’s Android KitKat 4.4 investment picks
2014/2/24
InvenSense, Inc. (NYSE:INVN), the leading provider of MotionTracking ™ system on chip (SoC) and Sound devices, introduces the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single chip platform solution with onboard Digital Motion Processor (DMP ™ ). For the first time, a single SoC delivers MotionTracking with absolute and relative altitude change for navigation, health and fitness applications.
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2013/12/13
InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking ™ and Sound sensor system on chip (SoC) devices, received two prestigious awards at the 2013 Global Semiconductor Alliance (GSA) Awards Dinner Celebration.
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2014/2/20
InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking ™ system on chip (SoC) and Sound devices, will demonstrate its latest ‘AlwaysOn’ platform solutions in booth # D61 in Hall 7 at the 2014 Mobile World Congress in Barcelona, Spain from February 24-27, 2014.
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2013/10/10
French electrical equipment maker Schneider Electric SA (SU.FR) said Thursday its acquisition of industrial and commercial technology company Invensys (SYS.LN) was approved by an overwhelming majority of Invensys shareholders.
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2013/12/18
http://at.marketwire.com/accesstracking/AccessTrackingLogServlet?PrId=1077171&ProfileId=051205&sourceType=1 CUPERTINO, CA --
Sign-up for Inventergy Inc. Enters Into Merger Agreement With eOn Communications investment picks
http://media.marketwire.com/attachments/201312/69861_inv.jpg http://at.marketwire.com/accesstracking/AccessTrackingLogServlet?PrId=1077938&ProfileId=051205&sourceType=1 CUPERTINO, CA --
Sign-up for Inventergy Inc. Quadruples Telecommunications Patent Portfolio, Acquiring 500 Patent Assets From Panasonic investment picks
2013/10/7
3-Cheese Stuffed Crust will Become First Permanent Pizza Offering Added to Brand's Menu in Almost Two Decades As Part of Launch, Pizza Hut to Reward Stuffed Crust Lovers in Three Cities with First Taste, And Allow America to Vote on Which City Gets It Next Prior To National Rollout PLANO, Texas , Oct.
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2013/9/18
RS Components (RS) and Allied Electronics (Allied) the trading brands of Electrocomponents plc (LSE:ECM), the world’s leading high service distributor of electronics and maintenance products, are marking the recent launch of the DesignSpark Mechanical 3D design software by bringing together top industry advocates from the worlds of electronic and industrial design in a 48-hour challenge to create an invention using this intuitive new 3D modelling and assembly tool, which is available completely free-of-charge.
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Logility Inc., a leading supplier of collaborative solutions to optimize the supply chain, will present in two educational sessions at the 2013 Global CSCMP Conference in Denver, CO, October 20 – 23, 2013.
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2013 Marks First Top-50 Appearance For Growing Specialty Food Company PHOENIX , Oct.
Sign-up for Inventure Foods Named to Forbes List of America's Best Small Companies For Second Consecutive Year investment picks
2014/2/27
Fourth Quarter Revenues Increased 35.2% to $58.9 Million Full Year Revenues Increased 16.4% to $215.6 Million PHOENIX, Feb.
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Net Revenues up 11.8% PHOENIX , Aug.
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2013/10/31
Net Revenues up 17.0%; EPS $0.11 PHOENIX , Oct.
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2013/9/24
PHOENIX , Sept.
Sign-up for Inventure Foods Signs Letter of Intent to Acquire Fresh Frozen Foods, LLC, a Frozen Vegetable Processor investment picks
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Articles From: Invensas and Tezzaron Partner to Deliver Commercial 3D-IC Products to Inventure Foods to Host Conference Call to Discuss Third Quarter 2013 Results on Oct. 31, 2013 at 11 a.m. ET
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