BOISE, Idaho and SHANGHAI, Feb. 7, 2013 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE) (NYSE:TEL), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook™ devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6mm for a standard SODIMM solution.
Micron's Single-Sided SODIMM is available in a 4GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.
"Given the depth and breadth of ultrathin devices currently on the market, coupled with consumer demands for sleek, lightweight designs, Micron's objective is to offer solutions that meet the specialized power, portability and battery life needs," said Kris Kido, Micron's Director of Business Development, Computing Devices. "Micron's unique Single-Sided SODIMM form factor meets those requirements and leads the way for future developments in this growing segment."
TE engineers designed the new single-sided DDR3 SODIMM connector to deliver peak performance with high-speed data applications. The connector features a 35 percent reduction in height, compared with similar low-profile connectors, which in turn, reduces the height of the end-product by 5 to 10 percent. It also reduces motherboard shadow area by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types.
"It's clear that we're seeing devices, ranging from Ultrabook™ devices to tablets, become increasingly thinner and sleeker," said Hook Chang, product manager, TE Consumer Devices. "In the past, the miniaturization of circuitry-powering device memory often compromised reliability. Our DDR3 SODIMM connector solves that problem, ensuring durable connectivity to optimize device functionality, speed and usability. Micron Technology shares our commitment to provide consumers with high-quality, reliable cost-effective solutions to maximize product performance."
Single-Sided SODIMM samples are available from Micron now, with mass production scheduled for Spring, 2013.
Single-Sided SODIMM connector samples are available from TE Connectivity now, with mass production scheduled for June, 2013.
With a global view of the mobile computing market, Micron is well positioned to support the growth of ultrathin applications. Our broad portfolio of industry-leading DRAM, SSD and NOR flash make high-performance, ultrathin computing come to life in the time it takes to snap your finger. Powerful, highly-responsive computing, instant-on/instant-off, rapid application load times, super slim and light designs, longer battery life and better power savings are all possible with Micron's memory and storage solutions.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
The Micron Technology, Inc. logo is available at http://www.globenewswire.com/newsroom/prs/?pkgid=6950
About TE Connectivity
TE Connectivity (NYSE:TEL) is a $13 billion world leader in connectivity. The company designs and manufactures products at the heart of electronic connections for the world's leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity's long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in over 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day. To connect with the company, visit: www.TE.com.
©2013 Micron Technology, Inc. All rights reserved. Information is subject to change without notice. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This news release contains forward-looking statements regarding the production of Single-Sided SODIMMs. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents Micron files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically Micron's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for Micron on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.
CONTACT: Zeno Group for Micron Mary Ellen Ynes email@example.com 650-801-7954 TE Connectivity Jeanne Wu firstname.lastname@example.org +86-21-33980729
|TE Connectivity’s NG4access Value-Added Modules (VAMs) to Be Unveiled at OFC / NFOEC (2013/3/5)|
|GE to Feature Latest AMD Processor Technology in New Industrial Computing Modules to Enhance Customer Choice (2013/4/23)|
|Bottomline Technologies Announces New Releases of Logical Ink® and MedEx® (2013/2/26)|
|Photo Release -- Avago Technologies Introduces New Generation of Smart Gate Drive Optocoupler (2013/1/31)|
|Photo Release -- Avago Technologies Introduces New Dual-Channel Bi-Directional High Speed Optocoupler (2013/5/14)|
|Photo Release -- Avago Technologies Introduces New Line of 2.5A Hermetic Gate Drive Optocouplers (2013/5/14)|
|Photo Release -- Avago Technologies Unveils New Gate Drive Optocouplers for High Switching Frequency Applications (2013/5/13)|
|New U.S. Market Data Shows ICU Medical's Needlefree IV Connector Technology Chosen More than Twice as Often as Any Other (2013/3/7)|
|Zilog Releases ZMOTION® Detection Module II Featuring Advanced Sensing Technology (2013/5/30)|
|Vishay Intertechnology Releases New Slew-Rate-Controlled P-Channel High-Side Load Switches in Compact WCSP6 Package (2013/4/25)|
|Tel Instrument Electronics Corporation||View tik Stock Quote|
|Tel Offshore Trust||View teloz Stock Quote|
|LF Tel SA||View piti3 Stock Quote|
|Tel. Pacific Limited||View tpc Stock Quote|
|Celik Halat ve Tel Sanayii A.S.||View celha Stock Quote|
|Tel Offshore Trust||View teloz Stock Quote|
|Bliss-Tel Public Company Limited||View bliss Stock Quote|
|Bliss-Tel Public Company Limited DR||View bliss-r Stock Quote|
|Net Tel International, Inc.||View ntel Stock Quote|
|Pegasus Tel, Inc.||View ptel Stock Quote|
|Start Premium Trial||Register For Free|
|P||F||Fund Financial Data (13,000+ funds)|
|P||F||Stock Financial Data (7,000+ stocks)|
|P||F||Stock and Fund Screeners (basic)|
|P||F||Investing Articles and Market Commentary|
|P||F||Articles Archive (>30 days)|
|P||F||Discuss (dozens of stock, fund, bond, and general bulletin boards)|
|P||F||Portfolio Manager (basic)|
|P||F||Morningstar Investment Classroom|
|P||F||Morningstar Investing Classroom Rewards (earn as you learn and redeem for Morningstar merchandise)|
|P||Morningstar Fund Analyst Reports (full research on 2,000 funds and ETFs)|
|P||Morningstar Stock Analyst Reports (full research on 2,000 stocks)|
|P||Morningstar Stock and Fund Stewardship Grades|
|P||Portfolio Manager (advanced with 10 x-ray analyses, including guidance)|
|P||Portfolio Monitor (monthly and on-demand personalized portfolio statements)|
|P||Morningstar Proprietary Stock Information (stock star ratings, buy/sell prices, economic moat ratings, and more)|
|P||Morningstar Stock and Fund Favorites & Red Flags eNewsletters|
|P||Premium Stock and Fund Screeners (advanced with nearly infinite ways to find the best securities for you)|
|P||Discounts on Morningstar newsletters, books, seminars, and more|
Access these features and more when you sign up for Free Membership.
Join Morningstar today. It's Free.
Access these features and more when you sign up for Premium Membership.
Start your free 14-day trial today online
Your subscription may be tax deductible. Please contact your tax advisor.