2013/2/26 - IXYS Integrates Thyristor and IGBT in the SMPD Module Platform

The patented SMPDModule platform has successfully improved reliability and reduced board size by offering surface mount solutions for systems up to 15kW. Using IXYS’ proprietary DCB isolated substrates the SMPD Module flexibility provides a platform for mixed technology and multiple die content, e.g., thyristor, IGBT, MOSFET and diode in boost, buck, parallel, half bridge, full and three phase bridges or two switches side by side topologies.

“Incorporating our thyristors with our IGBT’s has been a natural extension of our depth in power semiconductor technologies. The thyristors have been the highest power density switches for the industry and are relatively easy to drive as high side switches in bridge configuration. They conduct higher currents with higher efficiencies than FETs and IGBTs, thus a combination with FETs or IGBTs creates almost an ideal switch, where the high-side-high currents, are conducted by the thyristors, and high speed switching is done with the low side IGBTs in this product,” commented Dr. Nathan Zommer, CEO of IXYS Corporation. “More combinations of these technologies are possible, and will be introduced to our customers' needs as applications power devices (ASPD).”

Integration of the thyristor into a half bridge with an IGBT provides a one-stop solution for power designers needing to operate a low frequency bridge (thyristor) with higher frequency modulation (IGBT). The example of the IXA20PT1200LB is a 20A, 1200V SMPD surface mountable module which contains a thyristor at the high side and IGBT technology on the low side of a half bridge circuit allowing an energy efficient solution for applications such as current source micro-inverter, UPSs, power supplies, motor drives and medical applications.

“This latest release illustrates the true attraction of the SMPD Module platform to our customers,” commented Bradley Green, President of European Sales and Business Development. “Combining any number of our rugged, power efficient die technologies into innovative topologies and packing them in our surface mount, pick-and-place ready module platform for energy sensitive applications is a true differentiator.”

“The SMPD Moduleis a platform that provides ‘solution-scale’ resolution to power problems by reducing board real estate requirement and component count and weight and power loss due to parasitic inductance. We will continue to develop products which resonate with customers’ demand for MORE POWER - LESS PACKAGE and IXYS fully intends to retain the leading edge in providing innovation in this field,” Mr. Green continued.

For more information on this product innovation please go to the below link on the IXYS web-site: http://ixapps.ixys.com/DataSheet/IXA20PT1200LB.pdf.

For more information on the ISOPLUS^TM and SMPD Module and the numerous other solutions available in this package please refer to www.IXYS.com or contact your nearest IXYS sales office.

About IXYS Corporation

Since its founding, IXYS Corporation has been developing power semiconductors and mixed signal ICs to improve power conversion efficiency, generate solar and wind power and provide efficient motor control for industrial applications. IXYS and its subsidiary companies offer a diversified product base that addresses worldwide needs for power control in the growing cleantech industries, renewable energy markets, telecommunications, medical devices, transportation applications, flexible displays and RF power.

Safe Harbor Statement

Any statements contained in this press release that are not statements of historical fact, including the benefits, savings, efficiency, performance, features and suitability of products for various applications, may be deemed to be forward-looking statements. There are a number of important factors that could cause the results of IXYS to differ materially from those indicated by these forward-looking statements, including, among others, risks detailed from time to time in the Company's SEC reports, including its Form 10-Q for the quarter ended December 31, 2012. The Company undertakes no obligation to publicly release the results of any revisions to these forward-looking statements.

IXYS Corporation
Bradley Green, +44 (0) 1249 455585
b.green@ixys.ch