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Home>FLEXcon Announces Expanded THERMLfilm® HT™ Product Line

FLEXcon Announces Expanded THERMLfilm® HT™ Product Line

FLEXcon Announces Expanded THERMLfilm® HT™ Product Line

09/25/2017

FLEXcon Announces Expanded THERMLfilm ® HT Product Line

THERMLfilm ® HT 9000 Series for Labels Exposed to the Wave Solder Environment in the PCB Manufacturing Process and High-Temperature Labeling Applications

FLEXcon, an innovator in adhesive coating and laminating, today announced the global availability of four new high-temperature polyimide constructions to the FLEXcon® THERMLfilm® HT product line.

The new THERMLfilm® HT 9000 Series of products has been tested and approved for leaded and lead free reflow (top and bottom) in the wave solder environment and can withstand the fluctuating temperatures, abrasion and chemicals inherent in the printed circuit board (PCB) manufacturing process, while providing optimum printability (600 DPI) for high-density bar codes and alphanumeric information. The product line is ideal for electronics, automotive and aerospace manufacturers, and military contractors who need high-quality, cost-effective materials that meet industry standards, and for high-temperature labeling applications up to 750oF (398oC).

This series of products consists of 1 and 2 mil white polyimide films with a permanent acrylic pressure-sensitive adhesive, and backed with either a 50 lb. white glassine or a 1.5 mil clear polyester release liner. All products are UL/cUL Recognized under UL 969 – UL File No. PGJI2.MH16635 Printing Materials – Component. They are also UL/cUL Recognized with several thermal transfer resin ribbons.

PCB labels contain crucial information for the production process and if these labels are lost or illegible, the process can be disrupted and profitability can be impacted. The PCB manufacturing process is one of the harshest and most hostile environments to which pressure-sensitive films can be subjected. FLEXcon’s extensive development of the THERMLfilm® HT 9000 Series has resulted in products that meet industry standards and pass all the requirements for this most difficult environment.

FLEXcon conducted extensive testing at third party laboratories to ensure these products withstood the in-line reflow, wave solder and cleaning processes associated with the PCB manufacturing process, while offering excellent chemical, abrasion and heat resistance. These products endured the standard PCB process as measured by military specifications MIL-STD-202G and MIL-STD-883E, are compliant with European WEEE-RoHS and REACH directives, and are halogen free.

“Manufacturers understand that printability, chemical and heat resistance are the most critical factors when selecting materials that will endure the severe conditions of the PCB manufacturing process. For years, manufacturers have relied on FLEXcon’s successful line of THERMLfilm® HT films, and we recognized the need for polyimide products for the wave solder environment for contract manufacturers, end users and our customer base, with heightened performance and worldwide distribution,” said Ron Ducharme, Market Development Specialist, Product Identification Business Team, FLEXcon. “FLEXcon spent significant time and resources working with our co-supplier community to develop a polyimide product to meet the challenges of the PCB process. As a result, we are pleased to offer the THERMLfilm® HT 9000 Series.”

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