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SP Acquisition Holdings

  1. Microsemi Expands Customer Application Design Opportunities by Introducing SmartFusion2 Advanced Development Kit with Largest Density 150K LE Device

    Microsemi Expands Customer Application Design Opportunities by Introducing SmartFusion2 Advanced Development Kit with Largest Density 150K LE Device

  2. Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform

    Cadence IP Portfolio and Tools to Support New TSMC Ultra-Low Power Technology Platform

  3. Dialog Semiconductor Plc.: Dialog Semiconductor's Latest Family of DSP Audio CODECs Optimised for Superior Voice Control and Audio Experience

    Dialog Semiconductor Plc.: Dialog Semiconductor's Latest Family of DSP Audio CODECs Optimised for Superior Voice Control and Audio Experience

  4. ARM Supercharges MCU Market with High Performance Cortex-M7 Processor

    ARM Supercharges MCU Market with High Performance Cortex-M7 Processor

  5. Oclaro Demonstrates the Industry's First 200G Coherent CFP2 Pluggable Transceiver at ECOC 2014

    Oclaro Demonstrates the Industry's First 200G Coherent CFP2 Pluggable Transceiver at ECOC 2014

  6. Freescale Plans Extreme Performance for Kinetis MCUs with ARM® Cortex®-M7 Core

    Freescale Plans Extreme Performance for Kinetis MCUs with ARM® Cortex®-M7 Core

  7. Microsemi Introduces ZL38040, the First Timberwolf-based Product with New AcuEdge Acoustic Technology

    Microsemi Introduces ZL38040, the First Timberwolf-based Product with New AcuEdge Acoustic Technology

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