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SP Acquisition Holdings

  1. CEVA, Inc. Schedules Second Quarter 2014 Earnings Release and Conference Call

    CEVA, Inc. Schedules Second Quarter 2014 Earnings Release and Conference Call

  2. Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

    Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

  3. CEVA, Inc. Reports Inducement Grants Under NASDAQ Listing Rule 5635(c)(4)

    CEVA, Inc. Reports Inducement Grants Under NASDAQ Listing Rule 5635(c)(4)

  4. Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

    Microsemi Enables OEMs to Expedite Prototyping and Application Development with its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

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